Principal Embedded Firmware Engineer — AI/HPC Networking Silicon

United StatesRemoteFull-timelead

EngineeringEmbedded Engineer

2 views0 saves0 applied

Apply Now

Quick Summary

Requirements Summary

You are a seasoned embedded firmware engineer with deep expertise in low-level software, silicon bring-up, and secure firmware architecture. You bring strong technical judgment,

Technical Tools

EngineeringEmbedded Engineer

As a Principal Embedded Firmware Engineer, you will shape the firmware architecture powering next-generation networking silicon for AI and high-performance computing (HPC) infrastructure. You will lead the development of bare-metal firmware responsible for securely booting, provisioning, and supervising on-chip acceleration engines across complex, multi-die systems. Your work will establish the reliable infrastructure required to support demanding compute workloads at scale. Collaborating closely with ASIC, RTL, and software engineering teams, you will define hardware/software interfaces, strengthen security, and improve system bring-up and validation. You will combine hands-on engineering with technical leadership, architectural decision-making, code reviews, and mentorship. This fully remote opportunity is suited to an experienced firmware architect who enjoys tackling low-level silicon challenges and using AI-assisted engineering tools to accelerate development while maintaining rigorous quality standards.

You will own key elements of the embedded firmware architecture, ensuring that management firmware securely provisions, initializes, monitors, and updates on-chip acceleration engines. You will also establish engineering standards and guide technical execution across the platform.

Requirements

~1 min read

You are a seasoned embedded firmware engineer with deep expertise in low-level software, silicon bring-up, and secure firmware architecture. You bring strong technical judgment, a track record of leading complex engineering initiatives, and the ability to use AI-assisted development tools effectively without compromising reliability or security.

What We Offer

~2 min read

✓Competitive compensation: A comprehensive total rewards package combining base salary, equity, and performance-based incentives.

✓Individualized base pay: Salary determined by skills, qualifications, experience, and geographic location relative to the hiring range.

✓Performance incentives: Eligibility for an annual bonus or other incentives, depending on the role.

✓Medical coverage: Medical, dental, and vision insurance.

✓Insurance protection: Disability and life insurance, plus accidental injury insurance.

✓Additional coverage: Dependent care flexible spending account and pet insurance.

✓Retirement savings: 401(k) plan with employer matching contributions.

✓Paid time off: Generous paid holidays and Open Time Off (OTO) for regular full-time exempt employees.

✓Additional leave: Sick time, bonding leave, and pregnancy disability leave.

✓Flexible work environment: Fully remote work for employees residing in the United States.

✓Industry collaboration: Opportunities to work with influential organizations and experts across the semiconductor industry.

✓Innovative engineering environment: The opportunity to contribute to advanced AI and HPC networking technologies within a collaborative, technically ambitious team.

✓Equal opportunity: A commitment to fair employment practices, reasonable accommodations throughout the recruitment process, and consideration of all qualified applicants.