Module Development Engineer (Ph.D.) - Intel Foundry

About the Role

Intel Logic Technology Development (LTD) designs and scales the advanced semiconductor process technologies that power future generations of Intel architecture.

As a Module Development Engineer, you will drive the development, optimization, characterization, and high-volume manufacturing (HVM) transfer of leading-edge semiconductor processes.

• Patterning & Removal: Lithography, Overlay, Wet Etch, Dry/Plasma Etch, Chemical Mechanical Planarization (CMP).

• Thin Films & Doping: Epitaxy (EPI), Thin-Film Deposition (ALD/CVD/PVD), Diffusion, Ion Implantation, Metals/Metallization, Dielectrics.

• Metrology, Yield & Integration: In-line Metrology, FEOL/BEOL Process Integration, Defect Reduction, Yield Analysis, Electrical Characterization.

Key Responsibilities ("What You Will Do")

• Process & Hardware Engineering: Design, execute, and optimize experimental runs to advance semiconductor processes, equipment hardware, and new material capabilities.

• Process Control & Data Analytics: Apply statistical modeling, Design of Experiments (DOE), and control systems (SPC, APC, Run-to-Run) to reduce variability, mitigate defects, and drive yield enhancement.

• Cross-Functional & Vendor Collaboration: Partner with external tool/material suppliers and internal integration teams to co-develop cutting-edge equipment and process methodologies.

• HVM Technology Transfer: Resolve equipment, process, and yield excursion root causes to ensure smooth, robust technology transfer from development into high-volume manufacturing.

• Documentation & Technical Reporting: Document experimental findings, operating procedures, and technical recommendations through engineering reports and presentations.

Candidates must meet the following criteria (relevant experience may be gained through academic coursework, laboratory research, thesis work, internships, post doc, or publications):

Minimum Qualifications 

• Education: Ph.D. in Electrical Engineering, Chemical Engineering, Materials Science & Engineering, Physics, Mechanical, Chemistry, or a related STEM field (expected completion prior to start date).
• Hands-on Experience: 6+ months of experience with semiconductor fabrication, process development, device research, materials research, or related semiconductor technology, including one or more of the following: lithography (Litho)/overlay, epitaxy (EPI), wet etch, dry etch, thin-film deposition, diffusion, ion implantation, CMP/planarization, metals/metallization, dielectrics, metrology, process integration, yield, or electrical characterization. 

Preferred Qualifications 

• Environment & Tooling: 6+ months in a cleanroom or semiconductor research lab working directly with fabrication or analytical instrumentation (e.g., ALD, CVD, PVD, plasma etch, CD-SEM, TEM, AFM, spectroscopic ellipsometry). 

• Data Science & Automation: 6+ months utilizing statistical methodologies (DOE, SPC) and engineering software/scripting languages (Python, MATLAB, JMP, C#, or equivalents) for data analysis and automation. 

• Device Physics & Integration: Academic or research specialization in transistor architecture, advanced semiconductor materials, or FEOL/BEOL process integration. 

• Technical Dissemination: Proven track record of presenting technical findings through dissertations, peer-reviewed publications, conference proceedings, patents, or white papers. 

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