MEMS Deposition Process Engineer

• →Technical owner of the Dielectric Deposition Process and tooling
• →Uses Design of Experiment methodology to characterize process space and develop new production processes. Creates test plans to validate processes.
• →Qualifies new production processes using organizational change management procedures, in partnership with engineering and operations stakeholders.
• →Specifies new tooling and capital equipment purchases that are necessary for workcenter Assurance of Supply
• →Leads the workcenter and drives improvement in the following key areas: process sustaining, quality, equipment and capacity, and process development.
• →Exercises technical judgement, creativity, and initiative with attention to detail consistently throughout work output.
• →Collaborates and communicates with management, worldwide engineering partners, internal, and outsourced development partners regarding status, project progress, and issue resolution.
• →Leads project team of other process engineers and internal and outsourced development partners to develop reliable, cost effective and high quality solutions for moderately-complex products.
• →Represents the workcenter team for all phases of larger and more- complex development projects.
• →Solves difficult and complex problems with fresh perspective, demonstrating good judgment in selecting creative solutions and managing projects independently.
• →Delivers professionally written reports, and supports realization of operational and strategic plans.
• →Provides guidance and mentoring to less- experienced staff members to set an example of process design and development, innovation, and excellence.

• Four-year or Graduate Degree in Chemical Engineering, Electrical Engineering, Materials Science, Physics, or other related discipline.
• Typically has 2-5 years of work experience, preferably in wafer or package fab process engineering, with experience in process development, stabilization, sustaining, and quality systems.
• Prior experience with Plasma Enhanced Chemical Vapor Deposition (PECVD) or related deposition processes strongly preferred.

• Process development and characterization
• Process qualification
• Change management
• Process and tooling
• Equipment specification
• Technical communication
• Electrical Engineering
• Chemical Engineering
• Materials Science
• Physics
• Wafer fab
• Package fab
• Plasma physics
• Plasma processes
• Plasma Enhanced Chemical Vapor Deposition (PECVD)
• Statistical process control,
• Design of experiments, and problem-solving methodologies.

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