Silicon Package Design Engineer

India·Bangaloremid

EngineeringDesign Engineer

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Quick Summary

Key Responsibilities

- Develop physical layout designs for silicon packages, assembly test chips, and Intel's EMIB (Embedded Multi-die Interconnect Bridge) technologies.

Requirements Summary

At Intel, the Assembly and Test Technology Development (ATTD) Design group plays a crucial role in advancing the company's semiconductor packaging technologies.

Technical Tools

EngineeringDesign Engineer

The Role and Impact:

Responsibilities

~1 min read

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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