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Semiconductor Principal Design Engineer, Non‑Volatile Engineering Group

JapanJapan·Tokyolead
EngineeringDesign Engineer
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Quick Summary

Key Responsibilities

matching/symmetry for sensing paths, shielding/guarding for sensitive nodes. Parasitic-aware sizing and RC-driven timing closure. Array pitch constraints, blockages and repeatable layout templates.

Technical Tools
EngineeringDesign Engineer

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Principal Design Engineer in Micron’s NVEG (Non‑Volatile Engineering Group) organization will own and evolve the timing-critical circuitry between the NAND array and page buffer.

This role is for a designer who is equally strong in architecture, transistor-level implementation, and physical aware timing closure – and who can lead technical direction across teams to deliver robust, scalable datapath solutions. You will drive designs that directly impact throughput, timing margin, power and yield, partnering closely with page buffer, array device, clocking, physical design, test, and product teams.

Responsibilities

~1 min read
  • →Own internal NAND datapath circuits including array redundancy circuits, wave pipeline / pulse based datapath arctitechture and data line sensing circuits. Define scalable datapath architecture supporting multi-plane and high-parallelism operation.
  • →Define and analyse clock/data timing schemes for long interconnects and large-array topologies. Lead timing adjustment and skew management strategy.
  • →Drive layout-aware circuit design with attention to: matching/symmetry for sensing paths, shielding/guarding for sensitive nodes. Parasitic-aware sizing and RC-driven timing closure. Array pitch constraints, blockages and repeatable layout templates. Partner tightly with layout to review critical routes and implement practical fixes.
  • →Perform SPICE/Fast-SPICE simulations across PVT, aging and variability via Monte Carlo. Define characterization structures and debug plans to correlate silicon behavior vs. simulation. Drive root-cause analysis for margin/yield issues tied to datapath timing, redundancy paths or sensing robustness.
  • →Lead design reviews and unblock partners with clear technical decisions. Mentor other engineers; create reusable design collateral (checklists, templates, signoff methodology). Communicate tradeoffs effectively (PPA, margin, schedule, risk) and propose mitigation plans
  • →Communicate with project integration and other functional teams in design on specifications of major block interfaces

Requirements

~1 min read
  • BS or MS in Electrical Engineering with 8+ years of relevant experience
  • Experience in physical design flows and optimization
  • Proven ownership of blocks from concept -> design -> layout -> signoff -> silicon correlation,
  • Deep expertise in:
    • CMOS analog/mixed-signal circuit design and device physics fundamentals
    • High-speed datapath timing analysis (including nontraditional timing such as wave-pipelined/pulse-based)
    • Layout parasitics and physical implementation impact on circuit behavior
  • Strong simulation and debug skills (SPICE/Fast-SPICE, corner/MC analysis, failure-mode thinking)
  • Experience with managing complex design projects, effectively communicating progress and outcomes

  • Direct experience in NAND datapath and/or DRAM datapath design.
  • Wave-pipelining, self-timed, or pulse-latched pipeline design techniques
  • Redundancy/repair architecture experience in dense arrays (including repair timing implications)
  • Experience on DRAM interface(e.g. DDR4/5, LPDDR5/6, HBM3/3E/4) as well as other industry standard interfaces.
  • Comprehensive understanding on CMOS device and device reliability

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_japan@micron.com

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.   

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.

Location & Eligibility

Where is the job
Tokyo, Japan
On-site at the office
Who can apply
JP

Listing Details

First seen
October 3, 2026
Last seen
October 3, 2026

Posting Health

Days active
0
Repost count
0
Trust Level
51%
Scored at
October 3, 2026

Signal breakdown

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Semiconductor Principal Design Engineer, Non‑Volatile Engineering Group