HW/SW System and Application Engineer Intern-Summer 2027

• Develop embedded firmware and/or FPGA logic for High Frequency Modem wireless interface evaluation and demonstration platforms.
• Develop Python tools for automated test, data collection and analysis.
• Interface with evaluation hardware and laboratory equipment.
• Develop test cases to exercise wireless data-link operation under different conditions.
• Support hardware bring-up, debugging and system-level validation.
• Analyze collected data and identify performance limitations or unexpected behaviors.
• Contribute to development of demonstrations showcasing Wi-INT use cases.
• Document the test environment, results and recommendations.

• Pursuing a B.S. or M.S. in Computer Systems Engineering, Electrical Engineering, Computer Engineering or related field.
• Experience with C/C++ and Python.
• Experience with Verilog/SystemVerilog and FPGA development is highly desirable.
• Familiarity with embedded platforms.
• Experience with digital hardware design and testbench/simulation environments.
• Familiarity with Git and Linux.
• Exposure to PCB design and laboratory hardware debugging is a plus.
• Strong hands-on troubleshooting and analytical skills.

In order to be considered for a summer internship with NXP you must be returning to school or graduating at the conclusion of the internship term. If you are graduating prior to July 2027 please apply to Entry Level full-time roles.

More information about NXP in the United States...

NXP is an Equal Opportunity/Affirmative Action Employer regardless of age, color, national origin, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, marital status, status as a disabled veteran and/or veteran of the Vietnam Era or any other characteristic protected by federal, state or local law. In addition, NXP will provide reasonable accommodations for otherwise qualified disabled individuals.